Kalrez® 7075

A new compound with enhanced physical performance properties including very low compression set (15% O-rings per ASTM D 395B) and improved seal force retention. It is a carbon black filled compound utilizing new and proprietary cure chemistry technology with mechanical properties designed for improving sealing performance in both high temperature environments and temperature cycling situations. 7075 joins the family of Kalrez ® Spectrum™ products designed for the chemical processing industry. To provide even greater sealing performance in dynamic applications where low friction is required, 7075 O-rings have a glossier finish than other Kalrez ® parts. 7075 was specifically developed to be used as an O-ring or custom-sealing component in the chemical and hydrocarbon industries, with an improved thermal resistance that extends maximum service temperature to 327°C (620°F). Kalrez ® Spectrum™ 7075 offers the enhanced elastomeric properties outlined above while providing a chemical resistance better than the industry standard set by Kalrez ® 4079.

Kalrez® 4079

A low compression set compound for general-purpose use in O-rings, diaphragms, seals, and other parts used in the process and aircraft industries. It is a carbon black-filled compound with excellent chemical resistance, good mechanical properties, and outstanding hot air aging properties. It exhibits low swell in organic an inorganic acids and aldehydes and has good response to temperature cycling effects. A maximum operating temperature of 316°C (600°F) is recommended, with short excursions to higher temperatures possible. This compound is not recommended for use in hot water/steam applications or in contact with certain hot aliphatic amines, ethylene oxide and propylene oxide.

Kalrez® 6375

A carbon black-filled compound for general use in O-rings, seals, diaphragms and other specialty parts specifically for the chemical process industry. This compound has excellent, broad chemical resistance, good mechanical properties, and outstanding hot-air aging properties. 6375 is well suited for mixed process streams because of its excellent resistance to acids, bases, and amines. In addition, it is the suggested compound for use in hot water steam, ethylene oxide and propylene oxide. A maximum service temperature of 275°C (525°F) is recommended.

Kalrez® 1050LF

A general-purpose compound for O-rings, seals, and other parts used in chemical process industries. It has good hot water/steam, excellent amine resistance, and enhanced compression set properties. Maximum recommended service temperature of 288°C (550°F). Not recommended for use in organic or inorganic acids at high temperatures.

Kalrez® 1058

A carbon black-filled compound that has been plasticized with a perfluorinated oil. It is the softest, lowest modulus compound available. Generally, it is similar in chemical resistance to Compound 1050LF; it has an upper service temperature of 260°C (500°F). Typically used in applications that require how sealing force or high extensibility including liquid chromatography septa, seals/seats for relief valves and tubing. Its shrinkage is greater than other Kalrez compounds; therefore, finished parts may differ from standard specifications.

Kalrez® 3018

A carbon black-filled compound similar to Compound 1050LF, except for higher hardness/modulus. This compound offers the best hot water/steam resistance and the best high pressure extrusion resistance. Generally used in oil field and process industry applications where these properties coupled with good amine and general chemical resistance are required. A maximum service temperature of 220°C (428°F) is recommended.

Kalrez® 2035

A carbon black-filled compound that is well suited for selected applications in the finishings equipment, pharmaceutical, semiconductor, and chemical transportation markets. Compound 2035 has excellent chemical resistance exhibiting low swell in organic acids, inorganic acids, esters, ketones, and aldehydes. This compound is suggested for use in the ethylene oxide and propylene oxide applications. It also offers good mechanical properties. A maximum service temperature of 220°C (428°F) is recommended.

Kalrez® 2037

A non-black-filled compound that is well suited for selected applications in the pharmaceutical, semiconductor, and other markets that demand high purity elastomers. Compound 2037 has excellent chemical resistance exhibiting low swell in organic acids, inorganic acids, esters, ketones, and aldehydes. It also offers good mechanical properties. A maximum service temperature of 218°C (425°F) is recommended.

Miscellaneous Kalrez® Properties

Many miscellaneous properties are of interest for specific applications. Some of these are unaffected by compound choice, while others vary with hardness or extensibility. As an example, coefficient of friction typically increases as hardness decreases. In general, miscellaneous physical properties are similar to those of Viton® fluoroelastomer.

Note: Other specialty or custom compounds may be available or developed to applications that require different properties than the above compounds offer: 8375, 8385, 8101, 4001......


Typical Physical Properties*

Kalrez® Compound 7075 4079 6375 1050LF 1058 3018 2035 2037

Durometer Hardness,
Shore A, points ±5
(ASTM D2240)

75 75 75 82 65 91 85 79

100% Modulus, psi/MPa
(ASTM D412, 500 mm/mm (20in/mm))

1100/7.6 1050/7.2 1050 / 7.2 1800/12.4 675/4.7 2450/16.9 1250/8.6 900/6.2

Tensile Strength at Break, psi/MPa
(ASTM D412, 500 mm/mm (20in/mm))

2600/17.9 2450/16.9 2200/15.1 2700/18.6 1300/9.0 3150/21.7 2500/17.2 2450/16.9

Elongation at Break, %
(ASTM D412, 500 mm/mm (20in/mm))

160 150 160 125 180 125 150 200

Compression Set,
% at 70 hrs at 204°C (400°F)
(ASTM D395B, pellets)

12 25 30 35 40 35 25 27

Brittle Point, °C / °F
(ASTM D746)

  -50 / -58   -41/ -42 -40 / -40 -37 / -35 -54 / -65 -54 / -65

The information set forth herein is furnished free of charge and is based on technical data that DuPont Dow Elastomers believes to be reliable.  It is intended for use by persons having technical skill, at their own discretion and risk.  The handling precaution information contained herein is given with the understanding that those using it will satisfy themselves that their particular conditions of use present no health or safety hazards.  Because conditions of product use and disposal are outside our control, we make no warranties, express or implied, and assume no liability in connection with any use of this information.  As with any material, evaluation of any compound under end-use conditions prior to specification is essential.  Nothing herein is to be taken as a license to operate under or a recommendation to infringe on any patents.

*Not to be used for specifications


Kalrez® Semiconductor Applications and Compound Selector Guide

  Process Type Temperature Range Requirements Suggested Compounds* Comments Typical Applications
Plasma and
Gas Deposition
Etching 25 - 220°C CF4/CHF3
SF4
BCI3/CCI4/O2
8575
8375
8385

8575 - Optimum for plasma and gas deposition applications

8375 - Excellent plasma resistance, harder and higher moculus(good for dynamic and custom shape applications)

4079 - Excellent chemical resistance

Dynamic:

  • Gate valve
  • Door seal
  • Lip seal

Static:

  • Chamber lid
  • Electrode seal
  • Lamp seal
  • Exhaust valve
  • Gas inlet/outlet
  • Window seal
  • Center ring
  • Fittings, etc.
  • De-gas Chamber

Carrier:

  • Wafer
  • LCD panel
  • Conveyor, etc.
Ashing 25 - 220°C O2/O3/H2O
HDPCVD/PECVD/APCVD 25 - 220°C TEOS/O3
SiH4/O2
HCI/CF3/HBr
NF3/CF4/C2F6
PVD 25 - 220°C Ar
High Vacuum
8575
8375
4079
8385
Metal CVD 25 - 220°C TEOS/O3
SiH4/O2
HCI/CF3/HBr
NF3/CF4/C2F6
WF6CLF3
High Vacuum
Copper 25 - 220°C
Thermal Oxidation Diffusion 150 - 300°C N2
O2
H2O
HCI
8475
8375
4079

8475 - Optimum for dry thermal process applications. Low outgassing, excellent thermal stability, and long-term sealing performance

8375 - Low outgassing, excellent thermal stability and long-term sealing performance

4079 - Excellent thermal stability and long-term sealing performance

  • Quartz chamber seal
  • Fittings
  • Center ring
  • Plenum seals
LPCVD 150 - 300°C NH3
SiH2CI2
HCI
Lamp Anneal RTP 150 - 300°C Resistance to
IR absorption/
low outgassing
Wet Water Prep, Cleaning, and Rinsing 25 - 125°C UPDI, Piranha
SC-1, SC-2
HF (49%)
6375UP
4079
8201

6375UP - Optimum for wet process applications

4079 - Excellent chemical resistance

8201 - Low elemental, metallic, aniomic and TOC extractables

1050LF - Excellent amine resistance

  • Door/lid seals
  • Drain seals
  • Seals for chemical containers
  • Fittings
  • Seals for filters/ connectors
  • Flow meters
Etching 25 - 180°C HNO3/HF/H2O,
H3PO4/HNO3
Acetic/H2O
Photolithography Developing, and Rinsing 25 - 125°C H2SO4 + Oxidant
Organic Acids
NaOH, TMAH
Xylene, nMP
Stripping 25 - 125°C nMP/Alkanolamine
Hydroxlamine
6375UP
1050LF
Copper Plating 25 - 100°C CuSO4 Solution
H2SO4, H2O2
UPDI, O3
Citric Acid
6375UP
8201
1050LF

*Compounds in Bold are preferred.

Kalrez® Sahara™ 8375

The newest addition to the Sahara family of ultrapure products. This compound is formulated using a special blend of white filler that enables it to withstand the most severe dry and plasma processing environments. This white compound has been optimized for low weight loss and low particle generation in bothO2 and fluorine plasmas. Its combination of high temperature performance, mechanical properties, and low compression set characteristics make it an excellent choice for both static and dynamic dry process seal applications (e.g., gate valves, door seals, chamber lid seals, etc.). A maximum continuous service temperature of 300°C (572°F) is suggested. Static and dynamic service in all dry chemicals and plasmas. Ultrapure post-cleaning and packaging is standard for all parts made of compound 8375.

Kalrez® Sahara™ 8385

The original compound in the Sahara family of products developed as a result of ongoing efforts in partnership with key industry OEMs and fabs. Is exhibits excellent resistance to plasma and dry process chemistries. This 83 Durometer white compound has good mechanical properties and excellent vacuum sealing performance and is well suited for many static and dynamic applications (e.g., quartz tube seals, door seals, lip seals, etc.). A maximum continuos service temperature of 275°C (527°F) is suggested. Static and dynamic service in all dry chemicals and plasmas. Ultrapure post-cleaning and packaging is standard for all parts made of compound 8385.

Kalrez® Sahara™ 8575

The newest addition to the Sahara family of ultrapure products. This compound,specially formulated for improved performance in etch, CVD and strippingprocesses, offers lower cost of ownership with reduced contamination and longer seal life. This white perfluoroelastomer compound utilizes a new proprietary polymer and crosslinking system. It builds on the excellent plasma resistance of Kalrez Sahara 8375 with reduced weight loss, particle generation and outgassing, as well asimproved elastic recovery properties. Sahara Plasma 8575 offers excellent resistance to both O2 and fluorine plasma as wellas chlorinatedcleaning gasses (e.g., CIF3), exhibits axcellent vacuum and long term sealing performance, has good mechanical properties and is well-suited for both static and dynamic dry process seal applications (slit valve doors, chamber lids, gas inlets, ect) It's maximum continuous service temperature rating of 280°C (536°F) is well above the typical requirements for seals used in these processes. Ultrapure post-cleaning and packaging is standard for all parts made of Plasma 8575.

Kalrez® 8101

Offers excellent compression set characteristic for dry chemical processes and plasma environments. Its high service temperature rating, low outgassing characteristics, and low hardness make it well suited for vacuum service and low stress/low sealing force static applications. A maximum continuos service temperature of 300°C (572°F) is suggested. Static and low stress service in all dry chemicals and plasmas. Ultrapure post-cleaning and packaging is standard for all parts manufactured using compound 8101

Kalrez® 8201

Specially formulated for wet chemical process applications. In addition to its excellent resistance to Pirahna, UPDI, and other wafer etching, cleaning, and stripping chemistries, compound 8201 features lower elemental, anionic, and total organic carbon extractable than competitive perfluoroelastomer. A maximum continuos service temperature of 220°C (428°F) is suggested. Static service for minimal ionic extractable in all wet media. Ultrapure post-cleaning and packaging is standard for all parts made of compound 8201.

Industrial Compounds sometimes used in Semiconductor Applications

Kalrez® 4079

A low compression set compound for general-purpose use in O-rings, diaphragms, seals, and other parts used in the process and aircraft industries, as well as many wet and dry semiconductor process environments. It is a carbon black-filled compound with excellent chemical resistance, good mechanical properties, and outstanding hot air aging properties. It exhibits low swell in organic an inorganic acids and aldehydes and has good response to temperature cycling effects. A maximum operating temperature of 316°C (600°F) is recommended, with short excursions to higher temperatures possible. Static and dynamic, high temperature wet and dry, except )2/C12 plasmas. This compound is not recommended for use in hot water/steam applications or in contact with certain hot aliphatic amines, ethylene

Kalrez® 2037

A non-black-filled compound that is well suited for selected applications n the pharmaceutical, semiconductor, and other markets that demand high purity elastomers. Compound 2037 has excellent chemical resistance exhibiting low swell in organic acids, inorganic acids, esters, ketones, and aldehydes. it also offers good mechanical properties. A maximum service temperature of 220°C (428°F) is recommended. Static and dynamic service in dry chemical up to 200°C (428°F).

Kalrez® 4001

A non-filled compound, which is well suited for select high purity applications in pharmaceutical, semiconductor, and other markets. It has demonstrated good performance in oxygen and excellent performance in ozone-containing environments. its high service temperature rating and low harness make it well suited for vacuum service and low stress.low sealing force static applications. A maximum continuos service temperature of 275°C (527°F) is suggested. Static service in ozone-rich media and low seal force applications. Ultrapure post-cleaning and packaging is optional

Kalrez® 1050LF

A general-purpose compound for O-rings, seals, and other parts used in chemical process industries. Its is also recommended for use in select semiconductor wet process applications where high concentrations of certain amines are present. It has good hot water/steam, excellent amine resistance, and enhanced compression set properties. Maximum recommended service temperature of 288°C (527°F). Special applications; wet amine media or low outgassing at high temperature. Not recommended for use in organic or inorganic acids at high temperatures.

Typical Physical Properties

Kalrez®
Compound

Color Hardness
ShoreA
Service Temperature
°C(°F)
M100
Modulus
MPa (psi)
Comr. Set at 70 hr, 204°C (400°F) Filler System
Sahara™ 8375 White 76 300 (572) 5.1 (740) 20 Special Blend, white fillers
Sahara™ 8385 White 83 275 (527) 8.6 (1,250) 35 Special Blend, white fillers
Sahara™ 8575 White 74 280 (536) 2.5 (360) 29 Special Blend, white fillers
8101 Gray 65 300 (572) 2.3 (300) 18 Nonreactive filler
8201 Brown 79 220 (428) 4.5 (590) 29 Unfilled
4079 Black 75 316 (600) 7.2 (1,050) 25 Carbon black filled
2037 White 79 220 (428) 6.2 (900) 27 Mineral filled
4001 Black 58 275 (527) 1.4 (210) 13 Unfilled - Soft
1050LF Black 82 288 (550) 12.4 (1,800) 35 Carbon black filled

The information set forth herein is furnished free of charge and is based on technical data that DuPont Dow Elastomers believes to be reliable. It is intended for use by persons having technical skill, at their own discretion and risk. The handling precaution information contained herein is given with the understanding that those using it will satisfy themselves that their particular conditions of use present no health or safety hazards. Because conditions of product use and disposal are outside our control, we make no warranties, express or implied, and assume no liability in connection with any use of this information. As with any material, evaluation of any compound under end-use conditions prior to specification is essential. Nothing herein is to be taken as a license to operate under or a recommendation to infringe on any patents.